Apple is expected to unveil the new iPhone 7 in September, and while the company sticks with its super annoying secrecy, information coming from the upstream supply chain reveals that Intel will be in charge of making 50 percent of the modem chips to be installed on the future device.
At this point, it’s not yet known who’ll make the rest of the chips, but a report by Digitimes and citing industry sources reveals that Intel will build the modems for half of the iPhone 7 series with help from Taiwan Semiconductor Manufacturing Company (TSMC) and tester King Yuan Electronics (KYEC). Both companies will manufacture the new parts at their facilities, the same report adds.
The current iPhone generation comes with modems manufactured by Qualcomm, but Apple has been looking into the market for new partners since 2015, when it planned the creation of a device capable of reaching… (read more)
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